Using an X-ray microscopic inspection device with 0.4μ resolution, we provide customized (power supply and can take in air) nondestructive internal observation work (up to 400mm in diameter and a 5kg load).
Metals and resins are possible. However, materials with high density or thickness will be difficult to permeate, and may not be able to be inspected.
MARS-TOHKEN SOLUTION TUX-3200N
Printed circuit board section
X-ray source:
– Minimum resolution: 0.4μm
– Tube voltage: 20kV to 130kV
– Tube current: up to 200μA
Maximum geometric magnification:
-1200 times (monitor magnification 5760 times)
Stage:
– Size: 400mm in diameter
– Load weight: 5hg
– Stroke (X axis / Y axis): ±200mm/±150mm
– Stroke (Z axis / θ axis): 230mm / 360°
Detector tilt mechanism:
-0 to 60dp
Maximum inspection range:
-335mm x 300mm
X-ray micro inspection device (MARS-TOHKEN SOLUTION TUX-3200N)
Printed circuit board section
Relay
Solder ball
Airbag
Socket
Ball point tip